Planibond Hi-Mod Gel


Manufactured by Mapei Inc.
Brand: Planibond Hi-Mod Gel ®

High-Modulus, Non-Sag, Structural Epoxy Adhesive

Categories: 
Structures and Structural | Anchorages
Structures and Structural | Anchorages | Concrete | Chemical (Epoxy Resin)
  • ASTM International
    • ASTM C881/C881M - Epoxy-Resin-Base Bonding Systems for Concrete
    • ASTM C882 - Bond Strength of Epoxy-Resin Systems Used With Concrete By Slant Shear
    • ASTM D570 - Water Absorption of Plastics
    • ASTM D638 - Tensile Properties of Plastics
    • ASTM D648 - Deflection Temperature of Plastics Under Flexural Load in the Edgewise Position
    • ASTM D695 - Compressive Properties of Rigid Plastics


Melike Celik, Technical Specialist Engineer
Mapei Inc.
95 Walker Drive
Brampton ON L6T 5K5
m.celik@mapei.com
http://www.mapei.ca
Cellphone: 365-341-0217
Toll Free: 800-668-1212
Fax: 905-799-9870